Aluminum oxide and aluminum nitride
HTCC typically involves using alumina or other ceramic materials that can withstand high temperatures during the manufacturing process.
Allowing multiple materials to be fired together at high temperatures (often around 1400°C to 1600°C), resulting in strong, dense ceramics.
HTCC tape
TFICs are electronic circuits made by depositing thin layers of materials onto a substrate, typically less than a few micrometers thick.
Layered Structure: Composed of multiple layers, including semiconductors, insulators, and conductors, each serving specific functions.
High Density: Allows for high integration of components, enabling complex circuits in a smaller footprint.
Thin Film Integrated Circuit