Seal and solder glass is mainly used in airtight joints between 

glass, metal, ceramics, seam welding, plane bonding, electrical insulation sealing, etc., to meet the needs of products with different temperature performance, 

and customers can customize the specifications according to the structure of the product.

Customization to Fit Your Needs

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Create a hermetic seal between glass and metal parts, ensuring a leak-proof connection. 

These seals are crucial in applications where protection from environmental factors is needed, such as in electronic devices, sensors, and vacuum systems.

After encapsulation, the tube cap and base connect to create a sealed space that protects the chip and allows smooth optical signal transmission. Each microsphere lens needs to be optically centered to minimize performance deviation. This technology is mainly used in low-power devices, as well as infrared and communication transceiver devices on both the transmitter and receiver sides, ensuring high reliability.

Optics for metal housings encapsulated with cylindrical lenses.

Sapphire window glass and metal shell package, sapphire window through the area can be used from visible light to infrared wavelength band, because of its high strength, corrosion resistance, high transmittance and other advantages, so the device is used in a large number of optical components, infrared devices, high-strength radium lenses and photomask materials.

Glass powders are molten, cold quenched glass powders that are added to the ceramic base material. Their main function is to be used to lower the sintering temperature of the ceramic material, thus obtaining a material with good densification and equally good functionality in terms of electricity/magnetism in the range of lower (or suitable) sintering temperatures.

Low-temperature co-fired ceramics (LTCC) are produced by incorporating low-melting-point glass powder into ceramic powder. This addition lowers the sintering temperature by softening the glass and reducing viscosity during the sintering process. The resulting materials meet essential requirements for dielectric constant, temperature coefficient, resistivity, and chemical stability.

The glass powder used in microwave dielectric ceramic materials mainly plays a role in lowering the sintering temperature, and at the same time, it can ensure that the dielectric loss of the material is basically not deteriorated. Sintering temperature reduction can meet the MLCC (multilayer ceramic dielectric ceramic capacitor) preparation process for the metal electrode sintering temperature requirements.