In the manufacturing process of the semiconductor industry, it can be divided into four major steps: IC design, wafer manufacturing process, wafer testing and wafer packaging. The so-called wafer testing is to test the electrical characteristics of each grain on the wafer in order to detect and eliminate unqualified grains on the wafer.

LTCC/HTCC Technology in Probe Cards Probe cards are the core component in this segment of wafer and chip testing, providing the electrical connection between the wafer/silicon chip and the test instrument. In the whole probe card, the space transition substrates (STF substrates) are the core components. The STF substrates function as the electronic connection spacing and electrical signal transmission throughout the probe card, while providing sufficient mechanical/mechanical strength to support the hundreds to thousands of Newtons of force exerted during the test process.

The probe card (probe card body) is affected by the substrate material, and deformation occurs in multi-temperature (-55°C to 150°C) environments, especially at high and low temperatures. The probe is directly assembled on the probe card, and the deformation of the probe card will cause the probe trace (the trace left when the probe makes contact with the contact point of the wafer during wafer testing) to be offset. The offset of the trace usually makes the probe on the probe card and the PAD (pad) of the wafer poor contact, resulting in test instability, affecting test time and quality. Too large an offset of the trace will cause the contact between the probe and the PAD of the wafer to damage the internal circuitry of the wafer, leading to scrap and economic losses. At the same time, the probe card will also be scrapped because of the inability to perform wafer testing.

Precision ceramic substrates have excellent electrical insulation, high thermal conductivity, high adhesion strength and large current carrying capacity. The use temperature range is wide and can reach -55℃～850℃, and the coefficient of thermal expansion is close to that of silicon chips. It is one of the effective solutions for deformation in multi-temperature test environments.